Mijing Z20 Max iPhone X to 17 Pro Max Motherboard Middle Layer Stencil Kit

Description

Description

2025 MIJING Z20 MAX middle layer reballing platform for iPhone X-17 Pro Max motherboard mid-frame soldering repair. Upgraded MIJING Z20 Max iPhone motherboard middle layer frame tin planting fixture with BGA reballing stencil steel mesh for iPhone X/11/12/13/14/15/16/17 Pro Max motherboard soldering repair.

Option:
1. Mijing Z20 MAX iPhone X-16 Pro Max set.
2. Mijing Z20 MAX universal base.
3. Z20 MAX X-11 Pro Max reballing platform with stencil.
4. Z20 MAX iPhone 12 series reballing platform with stencil.
5. Z20 MAX iPhone 13 series reballing platform with stencil.
6. Z20 MAX iPhone 14 series reballing platform with stencil.
7. Z20 MAX iPhone 15 series reballing platform with stencil.
8. Z20 MAX iPhone 16/16 Plus/16 Pro/16 Pro Max reballing platform with stencil.
9. Z20 MAX iPhone 17/17 Air /17 Pro/17 Pro Max reballing platform with stencil.
Please note that the Z20 Pro has been updated to the Z20 Max, with an upgraded steel mesh featuring larger holes. The base and modules are compatible between the Z20 Pro and Z20 Max.

Z20 Pro/Max Features:
1. iPhone X-17 PRO MAX BGA reballing fixture tool.
2. Used for positioning and reballing iPhone X-17 Pro Max PCB BGA parts.
3. Convenient and faster for reballing BGA without any damage.
4. Offer you the best solution for iPhone X-17 Pro Max BGA reballing and repairing.

How to install:
1. Install the iPhone X-17 Pro Max main board on the platform
2. Cover the iPhone X-17 Pro Max BGA reballing stencil on mainboard
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.