Relife RL-400 RL-401 RL-402 No-clean 183°C Soldering Paste
Relife RL-400 RL-401 RL-402 No-clean 183°C Soldering Paste - Image 2
Relife RL-400 RL-401 RL-402 No-clean 183°C Soldering Paste - Image 3

Relife RL-400 RL-401 RL-402 No-clean 183°C Soldering Paste

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Description

Relife RL-400 RL-401 RL-402  No-clean 183°C Soldering Paste for Phones BGA Reballing Soldering

  • 183°C Solder paste with high quality
  • Solder wicking is strong
  • Less residual
  • No-clean
  • Alloy Ratio: Sn63/Pb37
  • Viscosity: 160 ~ 230Pa.s
  • The size of granule: 20-38um

Package includes:
1 x Soldering Paste

 

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