17%
Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888
Original price was: ₹299.00.₹249.00Current price is: ₹249.00.
In Stock
Did you like this product? Add to favorites now and follow the product.
Have a Question? Ask a Specialist
+91 9217060039 | +91 9217060038
Description
amaoe-012mm-wafer-positioning-bga-reballing-stencil-for-qualcomm-sm8350-snapdragon-888
Additional information
| Weight | 0.1 kg |
|---|
Be the first to review “Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888”
Related products
17%
Amaoe 0.12mm CPU BGA Reballing Stencil for MTK MT6879V Dimensity 1050
Original price was: ₹300.00.₹249.00Current price is: ₹249.00. In Stock
Recently Viewed Products
11%
MaAnt MR01 Face Lattice Maintenance Fixture For iPhone X-16Pro Max Dot Matrix Face ID Repair Fixture
Original price was: ₹2,000.00.₹1,799.00Current price is: ₹1,799.00. In Stock
17%
Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888
Original price was: ₹299.00.₹249.00Current price is: ₹249.00. In Stock
Reviews
There are no reviews yet.