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Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888

Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888

SKU: SM8350
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Original price was: ₹299.00.Current price is: ₹249.00.

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Description

amaoe-012mm-wafer-positioning-bga-reballing-stencil-for-qualcomm-sm8350-snapdragon-888

Additional information

Weight 0.1 kg

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