MIJING Z21max cpu tin planting table

Description

🔧 MIJING Z21 Max CPU Tin Planting Table

Type: CPU IC Chip Reballing & Tin Planting Platform
Used for: Precision CPU BGA reballing, tin ball placement, and IC rework on iPhone and Android motherboards during advanced electronics repair.

📌 Overview

The MIJING Z21 Max is a CPU reballing stencil platform / tin planting station that helps technicians accurately place solder balls (tin) onto CPU or BGA chip pads prior to soldering them onto a logic board. It’s built for consistent positioning and alignment of tiny BGA pads, reducing errors during rework.

🛠️ Key Features

✔ Precise Positioning:
Magnetic and mechanical alignment ensures the CPU or chip is accurately centered with the stencil holes for perfect tin placement.

✔ Strong Magnetic Clamping:
Integrated magnets hold the stencil and chip securely, preventing movement during solder paste or tin ball placement.

✔ High-Temperature & Durable Construction:
Made from alloy steel that resists bending, abrasion, and heat from rework processes, making it suitable for repeated use.

✔ Calibrated Stencil Mesh:
Each stencil mesh corresponds to factory-level pad geometry (for supported models) ensuring accurate solder joint alignment.

✔ Compatible with iPhone & Android CPUs:
Designed for a wide range of chips — typically iPhone A8 through A19 Pro series CPUs and many Android CPU/SoC BGA packages (Snapdragon, HiSilicon, etc.) depending on the specific set you choose.