B&R FX-9 GOLD INSULATION JUMPER WIRE FOR PCB REPAIR – 0.01MM

Description

B&R FX-9 0.01mm Ultra Fine Jumper Wire for Phone Motherboard BGA Fingerprint CPU Chip Solder Joint Repair Flying Line Copper Wire

• Suitable for iPhone,Android,Samsung and smartphones micro soldering work .
• 0.01mm motherboard jump wire phone cable fingerprint repair cable handset line.
• The wire is made of pure copper, and the surface is conductive.
• It can also be straightened to smaller, which is suitable for iPhone repairing fingerprint and other small soldering point.
• Insulation type,head and tail end just lectric conduction,the wire is small and easy to be straightened, and the diameter is around 0.01mm to make precise connection and avoid short-circuit solder joints.