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Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888
Original price was: ₹299.00.₹249.00Current price is: ₹249.00.
In Stock
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Description
amaoe-012mm-wafer-positioning-bga-reballing-stencil-for-qualcomm-sm8350-snapdragon-888
Additional information
| Weight | 0.1 kg |
|---|
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