MIJING Z21 Max CPU Tin Planting Table Base

Description

🔧 MIJING Z21 Max CPU Tin Planting Table Base

Type: CPU / BGA Reballing Tin Planting Platform (Base Fixture)
Used for: Precision tin ball placement and reballing CPU and BGA chips on iPhone and Android logic boards during professional repair and rework

📌 Overview

The MIJING Z21 Max Tin Planting Table Base is a magnetic reballing station designed to securely hold a CPU or BGA chip and its corresponding reballing stencil in perfect alignment. It serves as the foundation where tiny solder balls or tin paste are applied to the chip pads before reflow (soldering it back onto the motherboard).

🛠️ Key Features

✔ Strong Magnetic Base — A powerful magnetic surface automatically aligns and clamps the chip and stencil, keeping everything stable during the tin-planting process.

✔ Automatic Precise Positioning — Designed to ensure the chip and stencil mesh are perfectly aligned, minimizing errors and defective solder joints.

✔ High-Temperature & Durable Construction — Typically made from high-quality metal or alloy steel that resists heat, wear, and deformation during multiple reballing cycles.

✔ Universal Compatibility — Works with a wide range of CPU/BGA stencils for many devices:

• iPhone models: A8 up through A19 Pro (iPhone 6 through latest iPhone Pro Max).

• Android CPUs: Supports common Qualcomm, Hisilicon, and other BGA package chips when paired with the right stencil.

✔ Precise & Clean Stencil Support — The combination of the magnetic base and calibrated steel meshes ensures that solder balls are full, rounded, and accurately placed with minimal burrs